SiliconBurmuin draws strong connections with NimbleAI, also coordinated by IKERLAN, to align with commercial neuromorphic roadmaps and access state-of-the-art commercial and pre-commercial technology from partners – integrated into IKERLAN’s BEGI-EVK platform.
The NimbleAI technology integrated in BEGI-EVK has been highlighted by Yole as an enabler in achieving the “Neuromorphic 3D sensing” milestone. Specifically, LF-DVS technology aims to deliver near-VGA resolution and tens of mm depth accuracy for around 10 metres operational range with sub-ms latency and tens of mW energy consumption. SiliconBurmuin builds on this technology and makes it suitable to meet the needs of Basque industry.
NimbleAI is a €10 million Horizon Europe project running from 2022 to 2025 that brings together 20 partners from seven EU countries (Spain, France, Germany, Belgium, The Netherlands, Austria and Italy) as well as the UK. The consortium covers most of the semiconductor value chain and includes a world-renowned expert in insect perception.
The SoC4sensing University-Business chip Chair of the University of the Basque Country (UPV/EHU) aims to promote the training of professionals capable of tackling projects in microelectronic design aimed at most representative productive sectors in the Basque Country.
SoC4CRIS
Research on architectures for SoC semiconductor devices enabling the implementation of value-added functionalities for the Energy, Industry, and Aerospace sectors, including neuromorphic vision processing, photonic interface and sub-ns synchronisation and safe architectures for RISC-V-based SoCs.
